Function and Principle
Ux-720 new generation of domestic professional Coating Thickness Gauge with high resolution Si-PIN (or SDD Silicon Drift Detector) for industry leading measurement accuracy and results.
With FlexFP-Multi technology, we provide a friendly experience and fulfillment of inspection needs, whether it's quality control during the production process, or random sampling and full inspection during incoming material inspection and material performance inspection.
Ux-720 micro-mobile platform and HD CCD are paired with knob adjustments designed on the outside of the housing for easy and convenient observation of the moving position.
The application of X-ray fluorescence technology to test the thickness of plating layer improves the inspection conditions for mass production of plating products, non-destructive, fast and more accurate characteristics of the quality enhancement in the electronics and semiconductor industries have a guarantee of inspection.
Ux-720 plating thickness gauge using the latest patented technology FlexFp - Multi, not subject to the limitations of the standard sample, in the absence of plating specimens can be tested directly under the circumstances of the plating thickness of the sample, the test results stand up to scientific verification.
Can realize fully automatic one-button operation function, collimator automatic switching, filter automatic switching, open the lid at random automatic stop, sample test photos automatically take pictures, automatic saving, test report automatically pop-up, supplier information automatic screening and saving ......
Standard Accessories
Sample fixing bracket 1 pc
Window support film: 100 sheets
Fuse: 3 pcs
Computer mainframe: brand + dual-core
Display: 19-inch LCD
Printer: Inkjet printer
Optional accessories
Upgradeable to SDD detector
Sample movement is designed to be adjusted outside the sample chamber, which is convenient and quick to move the sample during multi-point testing and helps to improve the efficiency.
The design is more scientific, hardware and software cooperation, electromechanical linkage, radiation safety is higher than the national standard GBZ115-2002 requirements.
Software operation with hierarchical management rights of operators, general operators, supervisors use different user names and passwords to log in, the record of the test report at the same time automatically add the login name of the tester.
Product Specifications:
Thickness measurement technology: X-ray fluorescence thickness measurement technology
Lower limit of measurement: 0.003um
Measurement upper limit: 30-50um (determined by material elements)
Measurement layers: 10 layers
Measurement time: 30-120 seconds
Detector type: Si-PIN electrocooled
Detector resolution: 145eV
High voltage range: 0-50KV, 50W
X-ray tube parameters: 0-50KV, 50W, side window type;
Optical tube target: Mo target;
Filter: dedicated 4 kinds of automatic switching;
CCD observation: 2.6 million pixels
Micro shift range: XY15mm
Input voltage: AC220V, 50/60Hz
Test environment: non-vacuum conditions
Data communication: USB2.0 mode
Collimator: Ø0.5mm, Ø1mm, Ø2mm, Ø4mm
Software method: FlexFP-Mult
Workspace: Open workspace customization
Sample chamber: 330×350×75mm
Areas of application
Used in the electronics industry, hardware plating industry, metal alloy industry and precious metal analysis industry, specializing in metal alloys, aluminum profiles, plastics and other materials plating analysis, Dacromet coating layer analysis. Customer samples can be plated film thickness test, substrate composition analysis.
